Technology

Chip On Board, ...

Tape Automated Bonding (TAB)

Molding 

Heat sealing

HOT BAR soldering

SMT, uBGA , ...

Flip Chip Bonding

Mechanical parts assembly

Surface Mounting Components (SMT)

uBGA, CSP, ...

Two soldering technologies are used in the electronics industry: the wave soldering using a tin bath and the refusion soldering using a solder paste for the SMT components.

At microbonding, we retained the refusion soldering. This process consists in assembling electronic components on a printed circuit. The components are initially assembled automatically on a printed circuit on which was screen printed the solder paste. The unit is then transferred in a continuous furnace called oven refusion.

We make the SMT assembly in high density with all the components sizes: from the  0201 size, Fine Pitch, BGA, µBGA, CSP ..., either on single sided or double sided on every kind of substrates: rigid, ceramic, flexe, flexe - rigide, ... and in conjunction with other mounting technologies (TAB, COB, ...). 

We also make the assembly of the through holes components. 

LEAD FREE

The WEEE European directive imposes the progressive suppression of lead in the electronic soldering from July 2006. Currently, we are already working to be Lead-Free compatible; we will be ready during the first half year 2005. The two main alloys are tin/silver/copper or tin/copper mix. These alloys have higher melting points and their wetting speed on metal surfaces is slower. The joints have a different aspect because their surface is not as reflective as the tin/lead joints. 

Examples of realization:

              Double sided CMS with COB                        SMD on flex with TAB

uBGA   with 0.5mm pitch

Mixed technologies

A speciality is the SMT mounting from reel to reel.