Technology

Chip On Board, ...

Tape Automated Bonding (TAB)

Molding 

Heat sealing

HOT BAR soldering

SMT, uBGA , ...

Flip Chip Bonding

Mechanical parts assembly

Chip On Board (COB)

Chip On Flex (COF)

Chip On Chip (COC)

Multi Chip Module (MCM)

The most common interconnection method is the Chip On Board (COB). In the electronic systems, it offers the  possibility to integrate more functions in the same volume to fit to a limited place. 

The silicon chip is glued directly to the substrate and then connected by bonding with an aluminum wire or a gold wire with a diameter from 17.5 to 50 µm (no exhaustive list). An encapsulation resin (Glop top) can be dispensed on the unit or locally to guarantee stability against thermal and mechanical efforts, and to protect the assembly. 

We call Chip On Flex (COF): the COB assembly on flexible substrates.

COB Benefits

  * Size, weight and volume reduction.

  * Short interconnection to improve the signal performances.

  * Layout flexibility which can adapt to many dice ...

The tendency towards increasingly portable and miniaturized products encouraged conceptors to develop new packaging approaches. The Chip On Chip (COC) technology allows to assemble two dice or more (ones on the others) by using the COB technology. It is an ideal solution when we must realize a 3D unit for a higher miniaturization level. The Chip One Chip represents an additional step in the process of the COB and allows substantial place reductions.

One another approach also consists to glue the dice on other components, for example on SMTcomponents or on Flip Chip dice assembled.

The Multi Chip Modules (MCM) are "multi chips" modules, which contain various dices connected in the same package.

Microbonding SA is equipped for die mounting on rigid or flexible substrates and also on standard or specific package, for the wedge bonding (aluminium or gold) or gold Ball,  as for the coating with the most appropriate materials (epoxy, silicone, dielectric gel, UV Gloptop, ...).

We can also bond in "2d", on nonparallel levels between them or in deep cavities.

Examples:

COF          COC  

High density Bonding       Chip on CMS