Technology

Chip On Board, ...

Tape Automated Bonding (TAB)

Molding 

Heat sealing

HOT BAR soldering

SMT, uBGA , ...

Flip Chip Bonding

Mechanical parts assembly

Molding

Molding is the process of encapsulating the device in plastic material. Transfer molding is one of the most widely used molding processes in the semiconductor industry because of its capability to mold small parts with complex features. In this process, the molding compound is first preheated prior to its loading into the molding chamber. After pre-heating, the molding compound is forced by a hydraulic plunger into the pot where it reaches melting temperature and becomes fluid. The plunger then continues to force the fluid molding compound into the runners of the mold chase. These runners serve as canals where the fluid molding compound travels until it reaches the cavities, which contain the leadframes for encapsulation. 

        Mould cavity

The rising demand of new packages and fast prototyping led us to the introduction of this last step in back-end operations at Microbonding SA. Indeed, we are able to offer to you the molding of integrated circuits or hybrids in standard cases (DIL, SOIC etc.) or special developments according to your request. A sophisticated tool design allows the rapid introduction of new packages with a minimum of tooling cost and short lead-time.

Due to the modularity of the molding cavities quantities ranging from prototypes to series production can be delivered.

In close cooperation with our partners we offer our support in the design and fabrication of lead frames adapted to your products and packages.

Examples:  

Package for RFID application

Leadframes examples