Technology

Chip On Board, ...

Tape Automated Bonding (TAB)

Molding 

Heat sealing

HOT BAR soldering

SMT, uBGA , ...

Flip Chip Bonding

Mechanical parts assembly

HOT BAR Soldering

The Hot Bar soldering is a process allowing to weld two substrates (mainly a flexible circuit on a rigid circuit) using a thermode.

A hot bar soldered Flexe-to-PCB assembly can, in most applications, replace a Flexible Printed Circuit (FPC) at a lower cost. This technology can also be an alternative to connection solutions, saving the price of PCB connectors.

During the soldering operation, a thermode is applied to the parts with a predetermined pressure, that makes it possible to correctly maintain the flexe during the operation and to obtain a good contact during the simultaneous soldering of all the flexe leads on the  the PCB pads.

The soldering phase is characterized by a level temperature profile, it divides into three sequences: rising, dwell and cooling time. This process allows the creation of a permanent electro-mechanical bond between the parts and the solder. 

Today, the pitch of interconnection that we control is 0.5 mm. 

Examples:

Flexe with rigid PCB board                         Flexe with ceramic substrate

Flexe with flexe