Technology

Chip On Board, ...

Tape Automated Bonding (TAB)

Molding 

Heat sealing

HOT BAR soldering

SMT, uBGA , ...

Flip Chip Bonding

Mechanical parts assembly

Heat sealing

Microbonding SA started an active development in heat sealing and ACF connection (Anisotropic Conductive Film) already in 1986 and the processing in 1993.

Anisotropic conductive film, commonly known as ACF, is a epoxy system that has been used for almost 30 years in the flat panel display industry to make the electrical and mechanical connections from the drive electronics to the glass substrates of the displays. Since 10 years, this technology is largely employed to directly connect the drivers on glasses; this process is called Chip On Glass (COG).

ACF works by trapping conductive particles between the corresponding conductive pads on a substrates and the piece to be connected (die, LCD, other substrates,...). ACF consists of a very stable matrix of 3-5µ polymer spheres, each nickel-gold plated and then coated with a final insulating layer that protects them against shorting through contact with a neighboring particle.

During the bonding process, the insulation in the Z-axis where the balls are trapped is pushed away, allowing the Ni-Au layer on the particle to conduct electricity between the IC and the substrate, while not shorting in the X and Y directions. The epoxy cures, locking the particles in this compressed state. The resin matrix used by ACF is either thermopastic or thermoset, thus bonding is done through simultaneous application of heat and pressure with a thermode. 

Today, we are able to provide you services in these connecting technologies with various adhesives adapted to your needs. 

Examples:

COG Demonstrator