Services

Development

Conception

Fabrication – Test

Example

Our services

Microbonding controls all the miniaturization, chip-bonding and interconnection technologies for electronic module on flexible and rigid substrates.

Entrust us your specific problems so that together we work out innovative solutions!

Contact:  info@microbonding.com

Miniaturization and micro assembly require a continuous update of manufacturing processes, machines and hardware. 

In order to be able to assist you in these fields and to enable you to remain competitive without major investments, Microbonding SA let you benefit from his acquired know-how and offers you the following services:

Development

On the base of specifications of other document or starting from a simple idea of product, we propose you various possibilities of realization and we undertake the whole development or partly, from the design (layout), the prototypes and until the production.

Microbonding SA proposes to its customers to undertake the project at any stage of advance with the constant concern to make a success of the technology transfer.

We also undertake the development of the product of the stage of prototype, until industrialization for the applications such as HF and BF, hybrid, numeric, analogic ...

Conception

We propose you various possibilities of study and of realization according any substrate technology used (rigid printed circuit: double side, complex  multi-layer with BGA, mixed, flexible, thick and thin film ceramic,..) included:

              -      The schematic design 

              -      The design of the layout in accordance with the requirements of the various standards.

              -     The generation and the conversion of the data into the Gerber files for the manufacture of the substrates…

Our experience in high density assembly, as well as the co-operation with our suppliers enables us to provide you designs which are perfectly adapted to your needs.

Fabrication – Test

(From prototype to series)

In order to achieve a high miniaturization level with accessible costs and to make a success at the same time with an optimized manufacturing, we use state of the art technologies and machines, allowing assembly either in isolated parts, in multiples or from reel to reel.

We are also able to test the products with equipments designed in collaboration with our customer, or we will test only the assembly made in house.

Development Example 

Endoscopic camera head:

CCD image sensor ø: 2.4 mm  length: 7mm;  Image size: Diagonal 1.8mm (Type 1/10)

CCD image sensor ø: 5.5 mm length: 5.1mm;  Image size: Diagonal 3mm (Type 1/6)

Autonomous acquisition system:

Versions with the programming connector and the final capsule

Contact  Mr François SALCHLI;  EIVD; Institut MNT; av. des sports 14; CH-1400 Yverdon-les-Bains  SWITZERLAND

tél + 41 (0) 24 557 61 88      www.eivd.ch

On the demand of the Swiss Ornithologic Institute, Microbonding has again produced ultra light-weighted miniature transmitters for studying bird behaviors.