La miniaturisation, mais en plus petit     Miniaturization, but smaller     Miniaturisierung, noch kleiner
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ACF                                          Anisotropic Conductive           assemblage                             assembly                                 Verbindungstechnik                Assistance                                Technical Advice                    Auftragsfertigung                     BGA                                        Ball Grid Array                        câblage                                  Wire Bonding                          Drahtbonden CAO - Conception Assistée par Ordinateur         CAD - Computer Aided Design  Capteur                                               Sensor                                     céramique couche épaisse     thick film                                Keramik                                  CMS  Composants Montage en Surface                                  SMD Surface Mount Device    COB                                        Chip on Board                         COF                                         Chip on Flex                             COG                                       Chip on Glass                          COC                                        Chip on Chip                                               collage                                   Glueing                                  Aufkleben                               Conception                                                                            Konzeption                              CSP                                         Chip scale package                développement                      Development                          Entwicklung                           Die Attach                               équipement                            Bestückung                             électronique                                                electronic                               electronik                               Encapsulation                         erkapselung                            enrobage                                coating                                                                                  fichiers Gerber                        Gerber files                             industrialisation                       industrialization                       Industrialisierung                     Fine Pitch                                Flip Chip                                  Gang Bonding                                                Glob Top                                 HDI                                          Heat Sealing                           Heissiegeln                              Hot Bar                                    Innerlead-Bonding                                                                 interconnection                      interconnexion                        Verbindung                             LCD Display                                                                             Lohnfertigung                          MCM                                       Multi Chip Module                                               MEMS                                     Micro Electromechanical System. Système micro-usiné        micro assemblage                   Micropackaging                     microélectronique                  microelectronic                      microelektronik                      miniaturisation                        miniaturization                        Miniaturisierung                      OMT                                        Outerlead-Bonding                 PCB Assembly                          PCB Layout                                                Design                                     placement composants           Component Placement           production                                                                             Produktion                              prototype                                Rapid Prototyping                   Prototyp                                  puce                                       Die Dice  Chip                         Refusion                                  Reflow Soldering                    RFID                                         Radiofrequency Identification                          Routage                                  Schéma                                  Schematic                              Schematik                              Small size                                carte à puce                           Smart Card                              SMT                                         Surface Mounting Technology                                               Soudage                                 Soldering                                Schweißen                             sous traitance                          Subcontracting    Contract Manufacturing                        sous traitant                             Subcontractor                         Unterlieferant                          Stud bump                              Bumping                                 Substrat Flexible                       Flexible Substrates                    TAB                                          Tape Automated Bonding        test                                          Thermocompression                 Injection                                 Transfer Molding                      uBGA                                     

Underfill                                  Ball Wedge Bonding               Die attach                               pâte à braser                           solder paste